DocumentCode :
2989717
Title :
Micro-holes in gold foils machined by excimer laser ablation
Author :
Chen, Zhiling ; Liu, Sheng ; Shi, Tielin ; Liangcai Xion ; Qu, June ; Qiu, Yubin
Author_Institution :
Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2003
fDate :
28-30 Oct. 2003
Firstpage :
172
Lastpage :
175
Abstract :
Micro-holes in gold foils were machined by excimer laser ablation, to provide a useful micro-process for manufacturing a flat plane wire winding and transformer. The mechanisms of the excimer laser ablation were described. There are two classes of laser ablation mechanisms that are the excimer laser-induced thermodynamics process and the interaction process of photons, phonons and electrons generated by the laser plasma. In these experiments, the laser pulse energy, repetition frequency and pulse number were, respectively, set to 200-350 mJ, 50-150 Hz and 300-1000. We observed atomic force micrographs of holes in the gold foil. The thickness of the gold foil is 20-25 /spl mu/m. The diameter of the holes in the gold foil is 20-40 /spl mu/m.
Keywords :
atomic force microscopy; electron-phonon interactions; excimer lasers; gold; laser ablation; micromachining; photon-electron interactions; thermodynamics; 20 to 25 micron; 20 to 40 micron; 200 to 350 mJ; 50 to 150 Hz; ArF; Au; atomic force micrographs; excimer laser ablation; flat plane transformer; flat plane wire winding; gold foil micro-holes; laser plasma; laser pulse energy; laser pulse repetition frequency; laser-induced thermodynamics process; micromachining; microprocess; photons/phonons/electrons interaction process; Electrons; Gold; Laser ablation; Machine windings; Manufacturing; Optical pulses; Phonons; Pulse transformers; Thermodynamics; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
Type :
conf
DOI :
10.1109/EPTC.2003.1298718
Filename :
1298718
Link To Document :
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