Title :
Progress of research in MEMS packaging in China
Author_Institution :
Inst. of Microsystems, Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
A review of the MEMS packaging research in China is made in terms of the major research institutions, equipment, and research topics. The author also discusses the future plans of China in MEMS and MEMS packaging in the next two to three years.
Keywords :
electronics packaging; micromechanical devices; China MEMS packaging research; MEMS research institutions; packaging equipment; Bonding; Electronics packaging; Information technology; Materials reliability; Microelectronics; Micromechanical devices; Packaging machines; Software packages; Temperature sensors; Welding;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298720
