• DocumentCode
    2990176
  • Title

    Effect of Self-Weight and Non-Rigidity on the Bending Characteristics of Surface Micromachined MEMS Test Structures

  • Author

    Lee, Hing Wah ; Syono, Mohd Ismahadi

  • Author_Institution
    MIMOS Berhad, Kuala Lumpur
  • fYear
    2006
  • fDate
    Oct. 29 2006-Dec. 1 2006
  • Firstpage
    151
  • Lastpage
    154
  • Abstract
    This work studies the bending characteristics due to the effects of self-weight and non-rigidity induced on the surface micromachined (SMM) micro-electro-mechanical systems (MEMS) test structures. By using the available information of the linear bending stiffness for MEMS, the bending characteristics of the SMM MEMS cantilever test structure can be evaluated analytically. Results obtained from the analytical modeling have been compared with results from finite element analysis (FEA) using CoventorWare where the present analytical modeling showed good agreement with results obtained through FEA, establishing the methodology superiority. It is apparent that the finite anchor stiffness presence due to the non-rigid effect yields significant difference on the deflections of the SMM MEMS test structures while the effect of self-weight is negligible. It is thus deemed a necessity that the anchor´s flexibility should be incorporated in order to achieve good accuracy of the analytical modeling. This study also showed that the present analytical modeling is restricted to be employed only in the linear range. This is due to the fact that as the displacement increases, the geometrically nonlinear effect becomes conspicuous corresponding to the small deflection theory used to generate the analytical modeling.
  • Keywords
    bending; cantilevers; micromachining; micromechanical devices; surface treatment; CoventorWare simulation; aluminum cantilever; bending characteristics; finite anchor stiffness; linear bending stiffness; microelectro-mechanical systems; nonrigidity effects; self-weight effects; surface micromachined MEMS test structures; Analytical models; Automatic testing; Fabrication; Finite element methods; Information analysis; MIMO; Mechanical systems; Micromechanical devices; Structural beams; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    0-7803-9730-4
  • Electronic_ISBN
    0-7803-9731-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2006.381038
  • Filename
    4266588