The study on pad of AlN multilayer cofire ceramic substrate

Author

Yongda, Hu ; Ming, Jiang ; Bangchao, Yang ; Hao, Zhang ; Song, Cui ; Jingguo, Zhang

Author_Institution

Coll. of Microelectronics & Solid-Electronics, UESTC, Sichuan, China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

340

Lastpage

342

Abstract

Aluminum nitride (AlN) has been considered as a material for ceramic packages in the semiconductor industry toward higher speed, power dissipation and packaging density. A tungsten pad paste is proposed with Ni as additive for cofire multi-layer ceramic substrate. If 0.3%wt Ni is added in the pad paste, the paste and AlN tape have suitable shrinkage match. The sheet resistance is 10m /spl Omega///spl square/, substrate warp is less than 30 /spl mu/m/50mm and adhesion strength is greater than 42MPa.

Keywords

adhesion; aluminium compounds; ceramic packaging; firing (materials); multichip modules; nickel; semiconductor device packaging; shrinkage; sintering; substrates; tungsten; AlN; MCM; W:Ni; adhesion strength; ceramic packages; multilayer cofired ceramic substrate; nickel additive; semiconductor devices; sheet resistance; shrinkage match; sintering; substrate warp; tungsten pad paste; Aluminum nitride; Ceramics; Electronics industry; Nonhomogeneous media; Power dissipation; Semiconductor device packaging; Semiconductor materials; Sheet materials; Substrates; Tungsten;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298755

Filename

1298755