DocumentCode
2990540
Title
Challenges and advances in use-condition-based mechanical reliability test development
Author
Mercado, Lei L. ; Sahasrabudhe, Shubhada ; Monroe, Eric
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
368
Lastpage
370
Abstract
With rapid advances in the electronic packaging technology, reliability tests based on field conditions have become essential to the package reliability assessment. This paper discusses some major challenges and recent advances in both the assembly and end use condition characterizations and reliability test development.
Keywords
electronics packaging; integrated circuit reliability; mechanical testing; semiconductor device reliability; acceptance criterion; assembly condition; component robustness; cycles to failure; electronic packaging; end use condition; field conditions; mechanical reliability test; use-condition-based test; Assembly; Capacitive sensors; Electronic equipment testing; Electronics packaging; Failure analysis; Fatigue; Semiconductor device manufacture; Soldering; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298762
Filename
1298762
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