Title :
Experimental research on reliability of reflowed through-hole solder joints
Author :
Ding, Y. ; Wang, C.Q. ; Tian, Y.H.
Author_Institution :
State Key Lab. of Adv. Welding Production Technol., Harbin, China
Abstract :
An analysis on reliability of through hole solder joints under thermal shock was carried out in this paper. Compared with the traditional wave soldered joints, the response of reflow soldered joints to the thermal fatigue test were studied in non-destructive and destructive ways. Cracks were caused in solder joints by the coefficient of thermal expansion (CTE) mismatch. And the cracking extent in the reflow soldered joints were dissimilar to that in the wave soldered joints due to the difference of solder joint shape. Furthermore, the failure mechanics of solder joints were analyzed thoroughly.
Keywords :
failure analysis; reflow soldering; reliability; thermal expansion; thermal shock; thermal stress cracking; CTE mismatch; coefficient of thermal expansion; failure mechanics; reflowed through-hole solder joints; solder joint cracking; solder joint reliability; solder joint shape; thermal fatigue test; thermal shock; wave soldered joints; Electric shock; Fatigue; Joining materials; Performance evaluation; Shape; Soldering; Temperature; Testing; Thermal loading; Thermal resistance;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298764
