• DocumentCode
    2990587
  • Title

    Balancing material and exergy flows for a PCB soldering process: Method and a case study

  • Author

    Saiganesh, Subramaniam ; Sekulic, Dusan P.

  • Author_Institution
    Mech. Eng. Dept., Univ. of Kentucky, Lexington, KY, USA
  • fYear
    2010
  • fDate
    17-19 May 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Use of thermodynamics metrics (e.g. exergy) as sustainability analysis tools offers an insight into energy resources use in both energy and non-energy technologies. This study is devoted to an analysis of material, energy and exergy flows along a manufacturing line of a PCB-based products´ manufacturing operation. It is observed that a large quantity of available energy is inherently dissipated even if a state-of-the-art process is adopted. Drastic change in an approach towards developing new, transformational technologies are mandatory if a sustainable development is to be achieved through improvements of resources use. These changes may be guided by an insight obtained through thermodynamics metrics studies.
  • Keywords
    exergy; printed circuit manufacture; soldering; sustainable development; thermodynamics; PCB soldering process; energy flows; exergy flows; manufacturing line; sustainability analysis tools; sustainable development; thermodynamics metrics; Assembly; Availability; Energy resources; Entropy; Manufacturing; Mechanical engineering; Printed circuits; Soldering; Sustainable development; Thermodynamics; Exergy Analysis; Manufacturing; PCB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sustainable Systems and Technology (ISSST), 2010 IEEE International Symposium on
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    978-1-4244-7094-5
  • Type

    conf

  • DOI
    10.1109/ISSST.2010.5507708
  • Filename
    5507708