DocumentCode :
2990587
Title :
Balancing material and exergy flows for a PCB soldering process: Method and a case study
Author :
Saiganesh, Subramaniam ; Sekulic, Dusan P.
Author_Institution :
Mech. Eng. Dept., Univ. of Kentucky, Lexington, KY, USA
fYear :
2010
fDate :
17-19 May 2010
Firstpage :
1
Lastpage :
6
Abstract :
Use of thermodynamics metrics (e.g. exergy) as sustainability analysis tools offers an insight into energy resources use in both energy and non-energy technologies. This study is devoted to an analysis of material, energy and exergy flows along a manufacturing line of a PCB-based products´ manufacturing operation. It is observed that a large quantity of available energy is inherently dissipated even if a state-of-the-art process is adopted. Drastic change in an approach towards developing new, transformational technologies are mandatory if a sustainable development is to be achieved through improvements of resources use. These changes may be guided by an insight obtained through thermodynamics metrics studies.
Keywords :
exergy; printed circuit manufacture; soldering; sustainable development; thermodynamics; PCB soldering process; energy flows; exergy flows; manufacturing line; sustainability analysis tools; sustainable development; thermodynamics metrics; Assembly; Availability; Energy resources; Entropy; Manufacturing; Mechanical engineering; Printed circuits; Soldering; Sustainable development; Thermodynamics; Exergy Analysis; Manufacturing; PCB;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sustainable Systems and Technology (ISSST), 2010 IEEE International Symposium on
Conference_Location :
Arlington, VA
Print_ISBN :
978-1-4244-7094-5
Type :
conf
DOI :
10.1109/ISSST.2010.5507708
Filename :
5507708
Link To Document :
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