Self-sensed inspection of joint temperature for thin-film sensors

Author

Wang, Chenxi ; Wang, Chunqing

Author_Institution

State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China

fYear

2003

fDate

28-30 Oct. 2003

Firstpage

422

Lastpage

426

Abstract

This paper presents a new method named self-sensed inspection of joint temperature to measure the temperature during bonding process and assess joint quality for thin-film sensor. The thermoelectric force of interfaces was measured The top temperature was calculated during the bonding process through temperature calibration. Inspecting the top thermoelectric force monitored the joint quality. The method was examined successfully by bonding strength experiment and appearance of joints. Except for parallel gap bonding, it can also be used in other micro-joining methods.

Keywords

bonding processes; calibration; inspection; temperature measurement; temperature sensors; thermocouples; bonding process; bonding strength; equivalent thermocouple; interface thermoelectric force; joint quality; joint temperature; micro-joining methods; parallel gap bonding; self-sensed inspection; temperature calibration; thin-film sensors; Bonding processes; Calibration; Force measurement; Force sensors; Inspection; Temperature measurement; Temperature sensors; Thermal force; Thermoelectricity; Thin film sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on

Conference_Location

Shanghai, China

Print_ISBN

0-7803-8168-8

Type

conf

DOI

10.1109/EPTC.2003.1298773

Filename

1298773