Title :
Solder ball joints: voiding, qualification and mechanical issues
Author :
Collier, Terence
Author_Institution :
CVInc, USA
Abstract :
Solder ball failure can be caused by a number of technicalities. The three common root causes that lead to package failure are inadequate qualification, mechanical issues (typically due to IMC formation) and solder voiding (due to poor processes). To deliver acceptable customer performance, the process designer needs to understand the interactions of variables that can result in time zero as well as latent failure.
Keywords :
ball grid arrays; chemical interdiffusion; chip scale packaging; integrated circuit reliability; reflow soldering; thermal stresses; voids (solid); BGA; CTE mismatch; acceptable customer performance; bumped devices; chip scale packages; inadequate qualification; intermetallic growth; mechanical issues; package failure; solder ball failure; solder ball joints; solder voiding; Assembly; Chip scale packaging; Environmentally friendly manufacturing techniques; Gold; Guidelines; Lead; Process design; Qualifications; Temperature; Thermal expansion;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298774
