Title :
The effect of chemical species in the lead frame materials on the interface microstructure between copper alloys and SnPb solder
Author :
Fuxiang, Huang ; Hirowo, S.G. ; Xiaoyan, Li ; Jusheng, Ma
Author_Institution :
Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
Abstract :
The effect of chemical species in the leadframe materials on the interface microstructure between copper alloy and SnPb solder was studied by an optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy. The result showed that after aging at 160/spl deg/C for 300h, the intermetallic compound (IMC) at the interface between CuCrZr system, CuNiSi alloys and SnPb solder was formed as Cu/sub 6/Sn/sub 5/, which thickness was about 5/spl sim/10/spl mu/m. The IMC between C19400 alloy and SnPb solder was Cu/sub 6/Sn/sub 5/.,, which thickness was about 60/spl sim/70/spl mu/m. Pb particle and holes were found to be in the IMC, which would be harmful for reliability. The elements of Cr and Zn in CuCrZrZn alloy become rich at the interface between Cu and IMCs, leading to the retardation of the growth of IMCs.
Keywords :
X-ray chemical analysis; ageing; chemical interdiffusion; copper alloys; electronics packaging; eutectic alloys; lead alloys; lead bonding; optical microscopy; scanning electron microscopy; soldering; solders; tin alloys; 160 C; Cu/sub 6/Sn/sub 5/; CuCrZr; CuNiSi; SEM; SnPb solder; aging; chemical species; copper alloy; electronic package; energy dispersive X-ray spectra; eutectic solder paste; interface microstructure; intermetallic compound; lead frame materials; optical microscopy; Chemicals; Copper alloys; Dispersion; Electron optics; Lead; Microstructure; Optical materials; Optical microscopy; Scanning electron microscopy; Tin;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298777
