DocumentCode :
2990929
Title :
Surface and Composition Reactivity of Pt/GaN Catalytic Contact as Schottky Barriers Gas Sensor
Author :
Hudeish, Abdo Yahya ; Aziz, Aznita Abdul
Author_Institution :
Hodeidah Univ., Hodeidah
fYear :
2006
fDate :
Oct. 29 2006-Dec. 1 2006
Firstpage :
339
Lastpage :
341
Abstract :
Platinum (Pt) Schottky barrier formed on n-GaN is investigated for nitrogen (N2), hydrogen (H2) and methane (CH4) gas sensing applications. The samples are studied for its sensing performance using standard current-voltage forward biased characterisation and these data are correlate to contact grain size and porosity using X-ray diffraction and scanning electron microscope. It is shown that sensor sensitivity not only depends on barrier lowering compound formed at the metal semiconductor junction, but also on the size of the grain and the grain porosity. As such, Pt/n-GaN gas sensor sensitivity is dependent on type of gases and the temperature of the sensor. Maximum sensor sensitivity is achieved at Tdevice = 250degC with broad sensitivity plateau value from 100degC until 350degC showing the usefulness of Pt/nGaN sensor device at lower operating temperature (<400degC).
Keywords :
Schottky barriers; X-ray diffraction; catalysis; gallium compounds; gas sensors; grain size; platinum; porosity; scanning electron microscopes; surface chemistry; Schottky barriers gas sensor; X-ray diffraction; catalytic contact; composition reactivity; grain size; hydrogen; metal semiconductor junction; methane; nitrogen; platinum; porosity; scanning electron microscope; sensor sensitivity; standard current-voltage forward biased characterisation; surface reactivity; Electrons; Gallium nitride; Gas detectors; Grain size; Hydrogen; Nitrogen; Platinum; Schottky barriers; Temperature sensors; X-ray diffraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
Type :
conf
DOI :
10.1109/SMELEC.2006.381077
Filename :
4266627
Link To Document :
بازگشت