Title :
Metals/GaN Catalytic Contact Properties for Hydrogen Gas Sensor Applications
Author :
Hudeish, Abdo Yahya ; Aziz, Azlan Abdul
Author_Institution :
Hodeidah Univ., Hodeidah
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
Platinum (Pt), Palladium (Pd) and Nickel (Ni) as catalytic contact are successfully deposited on GaN substrates using dc sputtering method to be utilized as device for sensing hydrogen gas. The catalytic contact formation are studied in terms of its surface morphology and compound formation using atomic force microscopy (AFM) and high resolution X-ray diffraction (HRXRD) respectively, revealing the crystalline properties and uniform deposition of fine grains of the catalytic films. Sample roughness varied from 13.1 (Ni), 18.9.4 (Pd) to 25.4 nm (Pt), increases in parallel to its hydrogen sensing response capability. The formation of hydride compound on Pd and Ni catalytic layer and Ga3Pt2 on Pt layer are found to be significant in controlling the sensor response. Device fabricated using Pt as catalytic metal give smallest surface roughness value and capable of forming compound Ga3Pt2 with GaN substrate, identified as the main reason in reducing Schottky barrier height of the catalytic metal/GaN. As such, sensor produced using Pt is shown to have the best sensor response performance. Furthermore, surface roughness and compound formation on catalytic metal can be linked directly to sensor performance.
Keywords :
III-V semiconductors; Schottky barriers; X-ray diffraction; atomic force microscopy; catalysis; gallium compounds; gas sensors; hydrogen; sputtered coatings; surface morphology; surface roughness; wide band gap semiconductors; AFM; GaN; Ni; Pd; Pt; Schottky barrier; atomic force microscopy; catalytic contact properties; compound formation; crystalline properties; dc sputtering method; high resolution X-ray diffraction; hydrogen gas sensor; surface morphology; surface roughness; Atomic force microscopy; Gallium nitride; Gas detectors; Hydrogen; Nickel; Palladium; Platinum; Rough surfaces; Surface morphology; Surface roughness;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.381078