DocumentCode
2991084
Title
Laser ink-jet solder bump fabrication for electronic interconnection
Author
Li, Fuquan ; Wang, Chunqing ; Tian, Yanhong
Author_Institution
Nat. key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
476
Lastpage
478
Abstract
With the development of fine-pitch electronic interconnection, solder bump fabrication is becoming more and more important. Many bumping technologies have been developed. We can see the existing method has its merits as well as demerits. In this paper, we introduced laser ink-jet solder bump technology. The tests have shown that this method has distinctive merits. Selecting the appropriate parameters, we can produce appropriate solder bumps.
Keywords
fine-pitch technology; ink jet printers; integrated circuit interconnections; integrated circuit packaging; jets; laser deposition; spray coating techniques; LUT; MJT; electronic interconnection; electrostatically guided printing; fine-pitch interconnection; laser ink-jet solder bump fabrication; metal jet technology; Atmosphere; Costs; Electronics packaging; Gas lasers; Optical control; Optical device fabrication; Optical pulses; Size control; Temperature; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298784
Filename
1298784
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