Title :
Surface finishes in PWB fabrication
Author :
Song, Kelly ; Liu, Jim
Author_Institution :
Motorola Adv. Technol. Center-Asia, Motorola (China) Electron. Ltd., Tianjin, China
Abstract :
With the density of surface mount components increasing, ball grid array packaging (BGA) has become used more widely. The increased requirements on surface finish of printed wiring boards (PWB) turns out to be an even more important factor in current fabrication processes. In this paper, we introduced state of the art predominant finishes technologies and discussed their pros and cons. In addition, we show some related failure cases, which provide strong support for the above claim.
Keywords :
assembling; ball grid arrays; gold; nickel; printed circuit manufacture; surface finishing; surface mount technology; BGA; Ni-Au; PWB fabrication; PWB surface finishes; SMT density; ball grid array packaging; fabrication processes; surface mount components; Assembly; Coatings; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Fabrication; Gold; Lead; Nickel; Surface finishing;
Conference_Titel :
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8168-8
DOI :
10.1109/EPTC.2003.1298788
