DocumentCode
2991159
Title
Surface finishes in PWB fabrication
Author
Song, Kelly ; Liu, Jim
Author_Institution
Motorola Adv. Technol. Center-Asia, Motorola (China) Electron. Ltd., Tianjin, China
fYear
2003
fDate
28-30 Oct. 2003
Firstpage
497
Lastpage
501
Abstract
With the density of surface mount components increasing, ball grid array packaging (BGA) has become used more widely. The increased requirements on surface finish of printed wiring boards (PWB) turns out to be an even more important factor in current fabrication processes. In this paper, we introduced state of the art predominant finishes technologies and discussed their pros and cons. In addition, we show some related failure cases, which provide strong support for the above claim.
Keywords
assembling; ball grid arrays; gold; nickel; printed circuit manufacture; surface finishing; surface mount technology; BGA; Ni-Au; PWB fabrication; PWB surface finishes; SMT density; ball grid array packaging; fabrication processes; surface mount components; Assembly; Coatings; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Fabrication; Gold; Lead; Nickel; Surface finishing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on
Conference_Location
Shanghai, China
Print_ISBN
0-7803-8168-8
Type
conf
DOI
10.1109/EPTC.2003.1298788
Filename
1298788
Link To Document