Vertical signal transmission in three-dimensional integrated circuits by capacitive coupling

Author

Kühn, Stefan A. ; Kleiner, Michael B. ; Thewes, Roland ; Weber, Werner

Author_Institution

Siemens AG, Munich, Germany

Volume

1

fYear

1995

fDate

30 Apr-3 May 1995

Firstpage

37

Abstract

In this paper, methods for direct vertical transmission of digital signals between adjacent chiplayers in three-dimensional circuit structures are presented. Alternative circuit schemes are investigated and compared to state-of-the-art structures with respect to signal delay and power dissipation. Improvements of over 30% in terms of speed and up to an order of magnitude in terms of dynamic power dissipation are achievable. Analytical calculations, simulations and experimental results show the suitability of the architectures for vertical signal transmission of high bandwidth digital information

Keywords

VLSI; circuit analysis computing; comparators (circuits); coupled circuits; delays; digital signal processing chips; receivers; 0.5 mum; 3.3 V; analytical calculations; capacitive coupling; comparator; digital signal transmission; dynamic power dissipation; high bandwidth digital information; receiver architecture; signal delay; simulations; three-dimensional integrated circuits; vertical signal transmission; Capacitance; Coupling circuits; Delay; Digital integrated circuits; Hysteresis; Latches; Power dissipation; Pulse amplifiers; Signal processing; Three-dimensional integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 1995. ISCAS '95., 1995 IEEE International Symposium on

Conference_Location

Seattle, WA

Print_ISBN

0-7803-2570-2

Type

conf

DOI

10.1109/ISCAS.1995.521445

Filename

521445