Title :
An FIB Method Using Progressive Multi-Cut Technique & Application in Failure Analysis of Wafer Fabrication
Author :
Hong, Khoo Ley ; Younan, Hua ; Siping, Zhao ; Zhiqiang, Mo
Author_Institution :
Chartered Semicond. Mfg Ltd, Singapore
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
In this paper, an FIB method using progressive multi-cut technique is proposed and it has been applied in failure analysis of wafer fabrication. The application results showed that this method would greatly improve FIB cut success rate, especially for invisible defects. A case study on Vbd ramp up failure after QBD short loop will be presented.
Keywords :
cutting; failure analysis; focused ion beam technology; semiconductor device manufacture; sputter etching; QBD short loop; failure analysis; focused ion beam; progressive multicut technique; wafer fabrication; Cleaning; Design for quality; Fabrication; Failure analysis; Milling; Platinum; Protection; Silicon; Textile industry; Wood industry;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.380700
