High efficiency 850 nm Vertical-Cavity Surface-Emitting Laser using fan-pad metallization and trench patterning

Author

Mohd Sharizal Alias ; Leisher, Paul O. ; Choquette, Kent D. ; Sahbuddin Shaari

Author_Institution

Optoelectronic Device Cluster, Microelectronic & Nanotechnology Program, Telekom Malaysia Research & Development (TMR&D), UPM-MTDC, Lebuh Silikon, Serdang, Selangor, 43400 Malaysia

fYear

2008

fDate

4-6 Nov. 2008

Firstpage

1

Lastpage

4

Abstract

In this paper, fan-pad metallization and trench patterning were introduced in 850 nm Vertical-Cavity Surface-Emitting Laser (VCSEL) device packaging. Low threshold current and series resistance, which contributes to higher VCSEL efficiency, are obtained for the VCSEL with fan-metallization and trench patterning fabricated devices. Further, the output spectral characteristics show stable multimode operation for these devices. The results indicate that the proposed VCSEL packaging exhibits superior device performance compared to typical packaged VCSEL with square-pad metal.

Keywords

Fiber lasers; Metallization; Mirrors; Optical fiber LAN; Optical surface waves; Oxidation; Semiconductor device packaging; Semiconductor lasers; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International

Conference_Location

Penang, Malaysia

ISSN

1089-8190

Print_ISBN

978-1-4244-3392-6

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2008.5507777

Filename

5507777