• DocumentCode
    2992345
  • Title

    The Influence of Doping Concentration, Temperature, and Electric Field on Mobility of Silicone Carbide Materials

  • Author

    Tayel, Mazhar ; El-Shawarby, Ayman

  • Author_Institution
    Alexandria Univ., Alexandria
  • fYear
    2006
  • fDate
    Oct. 29 2006-Dec. 1 2006
  • Firstpage
    651
  • Lastpage
    655
  • Abstract
    This paper presents a study of the performance of the three most important silicone carbide (SiC) polytypes namely4H, 6H and 3C-SiC. The models describe the dependence of electron mobility on doping concentration, temperature, and electric field. The results show that SiC materials mobility almost degraded with increasing the doping concentration, temperature, and electric field. The significant degradation appear over the entire range of the electric field, which record, from 98% to 98.8% degradation. Temperature increase degrades the electron mobility from 80% to 84% and doping concentration increase degrades it by 34% to 50%. 4H-SiC behaves the better electron mobility among SiC materials. In addition, the models study the material conductivity under influence of electric field. 3C-SiC record the highest conductivity over the entire range of electric field. Silicon carbide materials are characterized in terms of Breakdown voltage, maximum frequency, Keyes´ figure of merit, and Johnson´s figure of merit. The results carried out that 4H-SiC has a maximum frequency and power for semiconductor devices. 6H-SiC share 4H-SiC the maximum thermal limitation and high frequency electrical performance.
  • Keywords
    doping profiles; electric breakdown; electron mobility; semiconductor doping; silicon compounds; wide band gap semiconductors; 3C-SiC; 4H-SiC; 6H-SiC; SiC; breakdown voltage; doping concentration; electrical conductivity; electron mobility; figure-of-merit; silicone carbide; Conducting materials; Conductivity; Degradation; Doping; Electron mobility; Frequency; Semiconductor materials; Semiconductor process modeling; Silicon carbide; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    0-7803-9730-4
  • Electronic_ISBN
    0-7803-9731-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2006.380714
  • Filename
    4266697