Solvent effect on the morphology of copper (I) oxide: A fundamental study towards copper (I) oxide-epoxy composites

The study on the influence of solvent environments on the Cu₂O particles preparation via aqueous to organic phase transfer technique is described. In aqueous, the morphologies of the as-formed particles are of whisker-like or ellipsoidal shape dependent on the amount of CTAB used. At lower concentration of CTAB (r=2.7), Cu₂O particles tend to form bundle of fine needle-like structures with an average diameter of 14.1±4.3 nm. Upon phase transfer process, transformation of Cu₂O morphology occurred. Two organic solvents namely chloroform and toluene is studied. Chloroform with higher dielectric constant and dipole moment exert better particle-solvent interaction thus give better particle dispersion as compared to toluene. Addition of 10% v/v epoxy in the organic solvent further affects the particles morphology. Spherical particles as small as 8.1 ± 2.1 nm are obtained for Cu₂O particles transferred into the 10%v/v epoxy/chloroform. Better solvation of epoxy resin in chloroform makes it a better stabilizer thus protecting the particles from agglomeration and secondary growth.