Title :
Failure Analysis of A Unique Poly Defect
Author :
Neo, S.P. ; Song, Z.G. ; Oh, C.K. ; Zhao, S.P.
Author_Institution :
Chartered Semicond. Manuf. Ltd., Singapore
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
To successfully identify the root cause of a failure, it is required to have systematic failure analysis approaches with the right techniques and to make detailed observation during the course of analysis. In this paper, detailed failure analysis has been present to identify the root cause of a unique poly defect through taking the right approaches and techniques.
Keywords :
failure analysis; semiconductor devices; semiconductor devices; systematic failure analysis; unique poly defect identification; Etching; Failure analysis; Feedback; Manufacturing processes; Oxidation; Performance analysis; Semiconductor devices; Silicon compounds; Tungsten; Wood industry;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.380725
