• DocumentCode
    2992701
  • Title

    A novel push-pull sampling methodology for test production in semiconductor manufacturing industries

  • Author

    Chow Leng Kwang ; Ong Eu Chin

  • Author_Institution
    Intel Technol. Sdn. Bhd., Bayan Lepas, Malaysia
  • fYear
    2008
  • fDate
    4-6 Nov. 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper describes the use of a push-pull sampling methodology on test products to improve manufacturing efficiency. The conventional test technologies heavily rely on manufacturing operators to manually input the necessary information to a station controller for processing a test lot. This approach has resulted in some quality issues of sampling miscalculation owing to under-sample requirements in test processes. A robust solution is developed by applying a two-stage push-pull methodology in a new automated sampling system. The push-pull approach of automated sampling controls and propagates the correct sampling data to the operators for them to run test lots with the correct samples. The system has contributed to improving manufacturing capacity, creating robust controllable system, reducing human handling or dependency, and shortening the lead time to end customers. All these have resulted in effective manufacturing control to eliminate non-value added activities and zero repeated quality cases in the manufacturing test environment. The overall ROI (return of investment) realized by this system is a cost saving of million dollars, by mitigating the cost of human errors against reduction of production cost per unit.
  • Keywords
    production testing; robust control; semiconductor device manufacture; automated sampling system; manufacturing control; manufacturing test environment; push-pull sampling methodology; robust controllable system; semiconductor manufacturing industries; test production; two-stage push-pull methodology; Automatic control; Costs; Humans; Manufacturing industries; Manufacturing processes; Production; Pulp manufacturing; Sampling methods; Semiconductor device manufacture; Semiconductor device testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
  • Conference_Location
    Penang
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-3392-6
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2008.5507804
  • Filename
    5507804