• DocumentCode
    2992733
  • Title

    Alignment Mark Architecture Effect on Alignment Signal Behavior in Advanced Lithography

  • Author

    Ahmad, Normah ; Hashim, Uda ; Manaf, Mohd Jeffery ; Abdul, K.I.

  • Author_Institution
    SilTerra Malaysia Sdn. Bhd., Kulim
  • fYear
    2006
  • fDate
    Oct. 29 2006-Dec. 1 2006
  • Firstpage
    732
  • Lastpage
    739
  • Abstract
    The downscaling of CMOS technology becomes a challenge to the scanner alignment system since overlay and alignment accuracy becomes tighter. Such a tight overlay requirement requires a very stable alignment performance. A stable alignment performance is indicates by a stable alignment signal generation. Hence, it is important to perform process characterization in order to choose an alignment mark, which generates the most stable signals. Different alignment mark type may show a different behavior in signal generation. In this paper, the signals behavior will be explored by experimenting using two different alignment mark architecture. This architecture can be further divided into three, which is AH32, AH53, and AH74. Based from the results, AH32 mark shows a significant trend difference between contact and metal mark. This is due to the fact AH32 contact mark is the easiest to be deformed since its feature size is the biggest compared to AH53 and AH74. AH53 and AH74 alignment signal performance between contact and metal mark are comparable.
  • Keywords
    CMOS integrated circuits; lithography; AH32; AH53; AH74; CMOS technology; advanced lithography; alignment mark architecture; alignment signal behavior; alignment signal performance; scanner alignment system; stable alignment signal generation; CMOS technology; Character generation; Etching; Lithography; Optical sensors; Planarization; Printing; Signal generators; Signal processing; Tungsten; Alignment mark; Alignment signal; lithography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    0-7803-9730-4
  • Electronic_ISBN
    0-7803-9731-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2006.380732
  • Filename
    4266715