Effects of in addition on solidus and liquidus temperatures, microhardness, and wettability of Sn-0.3Ag-0.7Cu solder alloy

Author

Kanlayasiri, Kannachai

Author_Institution

Fac. of Eng., King Mongkut´s Inst. of Technol. Ladkrabang, Bangkok, Thailand

fYear

2008

fDate

4-6 Nov. 2008

Firstpage

1

Lastpage

7

Abstract

This research was aimed to study effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, and microhardness of Sn-0.3Ag-0.7Cu lead-free solder alloy. It was found that In had a strong influence on these properties of Sn-0.3Ag-0.7Cu. Solidus and liquidus temperatures of the solder alloys was lowered as the In content was increased. However, In addition increased the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy was reduced by the addition of In while the wetting force was increased with the increase of In content. Microhardness of Sn-0.3Ag-0.7Cu was increased by adding In into the solder alloy. With the addition of In, the Sn-rich phase was smaller in size, and the intermetallic compounds were more uniformly distributed.

Keywords

copper alloys; indium alloys; microhardness; silver alloys; solders; tin alloys; Sn-Ag-Cu-In; intermetallic compounds; lead-free solder alloy; liquidus temperature effect; microhardness; solidus temperature effect; Alloying; Bismuth; Copper alloys; Gallium alloys; Indium; Mechanical factors; Microstructure; Temperature distribution; Testing; Tiles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International

Conference_Location

Penang

ISSN

1089-8190

Print_ISBN

978-1-4244-3392-6

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2008.5507809

Filename

5507809