• DocumentCode
    2992831
  • Title

    Physical-Based SPICE Model of CMOS STI y-Stress Effect

  • Author

    Tan, Philip Beow Yew ; Kordesch, Albert Victor ; Sidek, Othman

  • Author_Institution
    Silterra Malaysia Sdn. Bhd., Kulim
  • fYear
    2006
  • fDate
    Oct. 29 2006-Dec. 1 2006
  • Firstpage
    755
  • Lastpage
    758
  • Abstract
    In this paper, we proposed a new physical-based equation to model the CMOS transistor STI y-stress (in the direction of channel width). It can be used in any SPICE MOS model and it has been verified on 0.13 um CMOS transistors. The physical characteristics of the compressive STI y-stress effect on saturation drain current, Idsat are captured by using a new proposed transistor layout method. The equation that is able to describe the physical characteristics of the STI y-stress effect is incorporated into the electron and hole mobility, uO of the SPICE model to capture the y-stress effect on Idsat. With the combination of the new y-stress parameters and the default delta width parameters in the SPICE model, we are able to fit the simulation curve to the hook shaped Idsat curve from the actual silicon data.
  • Keywords
    CMOS integrated circuits; MOSFET; SPICE; electron mobility; hole mobility; semiconductor device models; CMOS transistor; compressive STI y-stress; default delta width parameters; electron mobility; hole mobility; physical-based SPICE model; saturation drain current; size 0.13 mum; transistor layout; Charge carrier processes; Compressive stress; Degradation; Electron mobility; Equations; MOS devices; SPICE; Semiconductor device modeling; Shape measurement; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    0-7803-9730-4
  • Electronic_ISBN
    0-7803-9731-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2006.380737
  • Filename
    4266720