DocumentCode
2992831
Title
Physical-Based SPICE Model of CMOS STI y-Stress Effect
Author
Tan, Philip Beow Yew ; Kordesch, Albert Victor ; Sidek, Othman
Author_Institution
Silterra Malaysia Sdn. Bhd., Kulim
fYear
2006
fDate
Oct. 29 2006-Dec. 1 2006
Firstpage
755
Lastpage
758
Abstract
In this paper, we proposed a new physical-based equation to model the CMOS transistor STI y-stress (in the direction of channel width). It can be used in any SPICE MOS model and it has been verified on 0.13 um CMOS transistors. The physical characteristics of the compressive STI y-stress effect on saturation drain current, Idsat are captured by using a new proposed transistor layout method. The equation that is able to describe the physical characteristics of the STI y-stress effect is incorporated into the electron and hole mobility, uO of the SPICE model to capture the y-stress effect on Idsat. With the combination of the new y-stress parameters and the default delta width parameters in the SPICE model, we are able to fit the simulation curve to the hook shaped Idsat curve from the actual silicon data.
Keywords
CMOS integrated circuits; MOSFET; SPICE; electron mobility; hole mobility; semiconductor device models; CMOS transistor; compressive STI y-stress; default delta width parameters; electron mobility; hole mobility; physical-based SPICE model; saturation drain current; size 0.13 mum; transistor layout; Charge carrier processes; Compressive stress; Degradation; Electron mobility; Equations; MOS devices; SPICE; Semiconductor device modeling; Shape measurement; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
0-7803-9730-4
Electronic_ISBN
0-7803-9731-2
Type
conf
DOI
10.1109/SMELEC.2006.380737
Filename
4266720
Link To Document