DocumentCode :
2992868
Title :
Dependence of Texture in Al Bondpads on Ta/TaN Bilayer Barrier and its Correlation to Optical Reflectivity in 0.13μm IC Technology
Author :
Ping, Lee Yuan ; Nistala, Ramesh Rao ; Younan, Hua ; Bhat, Mousumi
Author_Institution :
Chartered Semicond. Manuf. Ltd., Singapore
fYear :
2006
fDate :
Oct. 29 2006-Dec. 1 2006
Firstpage :
764
Lastpage :
767
Abstract :
In this paper, the dependence of crystallographic orientation in Aluminum thin films grown on different barrier-metal substrate schemes (Ta or Ta/TaN) will be presented. The orientation of Al grains will be shown to have a bearing on the material characteristics, which are important in IC fabrication from the perspective of both the device functionality and reliability. X-ray powder diffraction studies indicate that the films deposited on a single Ta layer are randomly oriented. On the other hand, a Ta/TaN bilayer substrate scheme results in preferred orientation along Al(111). A correlation will be established between the grain orientation and optical reflectivity properties of Al films. Moreover, the optical appearance of bondpads and their bondability are also influenced by the orientation of Al grains.
Keywords :
aluminium; crystal orientation; grain growth; integrated circuit bonding; integrated circuit technology; metallic thin films; Al-Ta-TaN; X-ray powder diffraction; barrier-metal substrate schemes; bilayer barrier; bondability characteristic; crystallographic orientation; grain orientation; integrated circuit technology; material characteristics; optical appearance; optical reflectivity; size 0.13 μm; thin films growth; Aluminum; Bonding; Crystalline materials; Crystallography; Fabrication; Optical films; Optical materials; Photonic integrated circuits; Reflectivity; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
Type :
conf
DOI :
10.1109/SMELEC.2006.380739
Filename :
4266722
Link To Document :
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