Title :
Root cause study on lid adhesion failure
Author :
Ong, M.C. ; Zhao, X.L. ; Zee, B. ; Joman, P.P. ; Chin, J.M. ; Master, Raj N.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
Abstract :
This paper studied the factors causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.
Keywords :
X-ray photoelectron spectra; adhesion; curing; electronics packaging; flip-chip devices; FTIR; XPS; adhesive curing; flip-chip package; lid adhesion failure; low water rinse flow; surface behaviour analysis; Adhesives; Bonding forces; Curing; Flanges; Manufacturing; Ovens; Packaging; Sealing materials; Spectroscopy; Tiles;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507812
