Title :
Modification and Modeling of Ni/Si Interface for Photodetector Applications
Author :
Hashim, M.R. ; Yusoff, M.Z.M.
Author_Institution :
Univ. Sains Malaysia, Penang
fDate :
Oct. 29 2006-Dec. 1 2006
Abstract :
We have demonstrated with both experiment and simulation, the method to modify the current response of n type silicon photodetector. The application of ultra-cooling temperature treatment (77 K) at various cooling times (15-60 minute) has been shown to significantly modify surface properties of n type silicon (100). The surface roughness of the untreated and treated samples was obtained using AFM techniques. Treated Si sample have better surface uniformity than untreated sample. The nickel (Ni) metal contacts were then deposited on the samples followed by current-voltage (I-V) characterisation. Treated samples showed increased dark and light currents compared with untreated sample. However, current gain (ratio of light to dark current) of some of the treated sample is enhanced while some are reduced compared with that of untreated sample. The simulation software ATLAS in SILVACO package is used to describe the effect of Ni/Si interface properties on its photodetection.
Keywords :
atomic force microscopy; electric current; elemental semiconductors; metal-semiconductor-metal structures; nickel; photodetectors; semiconductor device models; silicon; surface roughness; thermal analysis; AFM techniques; Ni-Si; SILVACO package; current gain; current response; current-voltage characterisation; interface properties; n type silicon photodetector; nickel metal contacts; simulation software ATLAS; surface properties; surface roughness; temperature 77 K; time 15 min to 60 min; ultra-cooling temperature treatment; Cooling; Dark current; Nickel; Photodetectors; Rough surfaces; Silicon; Software packages; Surface roughness; Surface treatment; Temperature;
Conference_Titel :
Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
0-7803-9730-4
Electronic_ISBN :
0-7803-9731-2
DOI :
10.1109/SMELEC.2006.380748