• DocumentCode
    2993196
  • Title

    Six sigma methodology in improving assembly yield of high-power and high-brightness ligth-emitting diodes packages for automotive application

  • Author

    Law, R.C. ; Li Zhang ; Beh, H.Y. ; Kmetec, J. ; Wall, Frank ; Chan, Catherine E. ; Koay, H.K.

  • Author_Institution
    Philips Lumileds Lighting Co. Sdn. Bhd., Lebuh Kampung, Malaysia
  • fYear
    2008
  • fDate
    4-6 Nov. 2008
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Six sigma methodology had been adopted by various companies such as Motorola, General Electric and Honeywell to improve quality of the product. Six sigma methodology is a systematic, well-disciplined and scientific-driven famous approach to improve process and reduce defeat. Package development and assembly of high power and high brightness LED for automotive application is a challenging task. It involves various new technologies and processes to enable the assembly of high performance LED package with stringent reliability, thermal, optical and quality requirement. The six sigma project improvement in this paper involves defects reduction in processes of multi-array thermosonic gold to gold interconnects bonding, ceramic substrate to lead frame AuSn eutetic bonding and aluminum ribbon bonding. This paper will discuss every steps involved in DMAIC approach for six sigma methodology. The yield of the processes involved in six sigma project charter scopes had improved after completion of the six sigma project. The result from yield compilation indicates six sigma approach can help company in term of quality management and business growth.
  • Keywords
    assembling; automotive electronics; electronics packaging; lead bonding; light emitting diodes; six sigma (quality); DMAIC approach; aluminum ribbon bonding; automotive application; ceramic substrate; high performance LED package assembly; high-brightness light-emitting diodes packages; high-power light-emitting diodes packages; lead frame AuSn eutetic bonding; multiarray thermosonic gold to gold interconnect bonding; quality management; six sigma methodology; Assembly; Automotive applications; Bonding; Brightness; Gold; Light emitting diodes; Optical interconnections; Packaging; Power system reliability; Six sigma;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
  • Conference_Location
    Penang
  • ISSN
    1089-8190
  • Print_ISBN
    978-1-4244-3392-6
  • Electronic_ISBN
    1089-8190
  • Type

    conf

  • DOI
    10.1109/IEMT.2008.5507829
  • Filename
    5507829