DocumentCode
2993254
Title
Multi-modal built-in self-test for symmetric microsystems
Author
Deb, Nilmoni ; Blanton, R.D.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2004
fDate
25-29 April 2004
Firstpage
139
Lastpage
147
Abstract
A mathematical model analyzing the efficacy of a built-in self-test technique, applicable to any symmetrical MEMS microstructure, is developed. The model predicts that the BIST technique can also be used to characterize a wide range of local manufacturing variations affecting different regions of the device. Model predictions have been validated by simulation. Specifically, it has been shown that by using a suitable modulation scheme, sensitivity to linear etch variation along a particular direction is improved by nearly 30%.
Keywords
accelerometers; built-in self test; micromechanical devices; modal analysis; production testing; sensitivity analysis; BIST modulation technique; accelerometers; linear etch variation; local manufacturing variations; mathematical model analysis; multimodal built-in self test; sensitivity; symmetric microsystems; symmetrical MEMS microstructure; Automatic testing; Built-in self-test; Costs; Etching; Integrated circuit technology; Manufacturing; Micromachining; Micromechanical devices; Predictive models; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 2004. Proceedings. 22nd IEEE
ISSN
1093-0167
Print_ISBN
0-7695-2134-7
Type
conf
DOI
10.1109/VTEST.2004.1299237
Filename
1299237
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