DocumentCode
2993283
Title
Package autoclave delamination study by substrate design improvement
Author
Liu, J.M. ; Yao, J.Z.
Author_Institution
Freescale Semicond. (China) Ltd., China
fYear
2008
fDate
4-6 Nov. 2008
Firstpage
1
Lastpage
4
Abstract
When developing new MAPBGA package, package delamination was found after 96hrs autoclave test (121C, 100%RH, 15psig) through CSAM check and cross section analysis. MSL 3, 260C preconditioning was performed before the autoclave test. The improvement study was made on substrate power/ground gold ring design, substrate copper metal roughness and substrate metal layer design. Finally, the package delamination was completely removed by optimizing substrate design.
Keywords
ball grid arrays; delamination; substrates; CSAM check; MAPBGA package; cross section analysis; package autoclave delamination; substrate copper metal roughness; substrate design improvement; substrate metal layer design; Copper; Delamination; Electromagnetic compatibility; Electronics packaging; Gold; Rough surfaces; Semiconductor device packaging; Substrates; Surface roughness; Testing; Inner Metal Layer Design; Package Delamination; Substrate Design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location
Penang
ISSN
1089-8190
Print_ISBN
978-1-4244-3392-6
Electronic_ISBN
1089-8190
Type
conf
DOI
10.1109/IEMT.2008.5507832
Filename
5507832
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