• DocumentCode
    2993630
  • Title

    The Study of Pt/porous GaN Schottky Contact for Hydrogen Sensing

  • Author

    Yam, F.K. ; Ali, Y.P. ; Hassan, Z. ; Noor, N. H Mohd ; Chin, C.W.

  • Author_Institution
    Univ. Sains Malaysia, Penang
  • fYear
    2006
  • fDate
    Oct. 29 2006-Dec. 1 2006
  • Firstpage
    951
  • Lastpage
    954
  • Abstract
    This article presents the studies of Pt Schottky contact on porous n-type GaN for hydrogen sensing. Porous GaN was generated by UV assisted electroless chemical etching. Hydrogen sensor was subsequently fabricated by depositing Pt Schottky contacts onto the porous GaN sample. For comparative study; a standard hydrogen sensor was also prepared by depositing Pt Schottky contacts on the as- grown sample using same processing tools and under identical parameters. Hydrogen detection was carried out at room temperature in an enclosed chamber. Pt/porous GaN sensor exhibited a significant change of current upon exposure to 2% H2 in N2 as compared to the standard Pt/GaN sensor. Morphological studies by scanning electron microscopy (SEM) revealed that Pt contact deposited on porous GaN have a very rough surface morphology with pores distributed all over the contact layer. Therefore, the steep increase of current could be attributed to the unique microstructure at porous Pt/porous GaN interface, which allowed higher accumulation of hydrogen and eventually led to stronger effect of the H- induced dipole layer.
  • Keywords
    Schottky barriers; chemical sensors; hydrogen; GaN; GaN Schottky contact; H; Pt; Pt Schottky contact; Pt/porous GaN sensor; UV assisted electroless chemical etching; hydrogen detection; hydrogen sensing; scanning electron microscopy; Chemical sensors; Etching; Gallium nitride; Hydrogen; Rough surfaces; Scanning electron microscopy; Schottky barriers; Sensor phenomena and characterization; Surface roughness; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    0-7803-9730-4
  • Electronic_ISBN
    0-7803-9731-2
  • Type

    conf

  • DOI
    10.1109/SMELEC.2006.380780
  • Filename
    4266763