DocumentCode :
2994067
Title :
Highly resistive FET buffer layers on InP grown by LP-MOVPE
Author :
Decobert, Jean ; Regreny, P. ; Maher, H. ; Le Pallec, M. ; Falcou, A. ; Juhel, M. ; Post, G.
Author_Institution :
CNET, Bagneux, France
fYear :
1997
fDate :
11-15 May 1997
Firstpage :
74
Lastpage :
76
Abstract :
Electrical characteristics of field effect transistors (FETs) grown on Fe-doped InP substrates are extremely dependent on the presence of a buffer with suitable resistivity below the active channel. The growth of a semi-insulating (SI) buffer layer on the InP substrate is required to compensate the n-type impurities (silicon) accumulation on the epi-ready substrate surface, responsible for parallel conduction at the substrate/buffer interface. Known techniques to prevent parasitic conduction in MOVPE growth could not be reproduced successfully in our reactor or were not compatible with the use of patterned substrates for OEIC processing. In this report, we describe new growth methods of semi-insulating buffers, using low pressure metalorganic vapor phase epitaxy. In both cases, specific growth procedures described below have allowed complete compensation of the electrical activity of n-type impurities at the interface
Keywords :
III-V semiconductors; field effect transistors; indium compounds; semiconductor epitaxial layers; semiconductor growth; vapour phase epitaxial growth; Fe-doped InP substrate; InP:Fe; LP-MOVPE growth; OEIC processing; electrical activity; field effect transistor; metalorganic vapor phase epitaxy; n-type impurity compensation; parasitic conduction; patterned substrate; semi-insulating buffer layer; sheet resistivity; Buffer layers; Conductivity; Electric variables; Epitaxial growth; Epitaxial layers; FETs; Impurities; Indium phosphide; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 1997., International Conference on
Conference_Location :
Cape Cod, MA
ISSN :
1092-8669
Print_ISBN :
0-7803-3898-7
Type :
conf
DOI :
10.1109/ICIPRM.1997.600032
Filename :
600032
Link To Document :
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