Title :
Important qualification process to wafer probing
Author_Institution :
Nat. Semicond. Sdn. Bhd., Batu Berendam, Malaysia
Abstract :
Wafer fabrication technology has overcome many challenges and achieved small pitch at high current density nowadays, hence durable and sustainable probing tools are essential. Since good qualification process determines good tools to use, the scope of study in probe card fabrication has to be comprehensive enough to cover all that needed to be covered in forming an effective wafer probing characteristics. National Semiconductor has conducted a series of experiments looking into probing characteristics over a period of time. From the experimental results, conclusions were reached to setup guidelines to be applied to probe card fabrication with correct probe pressure.
Keywords :
probes; wafer level packaging; National Semiconductor; durable probing tools; probe card fabrication; probe pressure; qualification process; sustainable probing tools; wafer fabrication technology; wafer probing; Assembly; Circuits; Fabrication; Metallization; Nonhomogeneous media; Probes; Qualifications; Testing; Tiles; Wire;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507868