Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder

Author

Fa-Xing Che ; Jing-en Luan ; Yap, Danny ; Kim-Yong Goh ; Baraton, X.

Author_Institution

Corp. Packaging & Autom., STMicroelectronics, Singapore, Singapore

fYear

2008

fDate

4-6 Nov. 2008

Firstpage

1

Lastpage

6

Abstract

With the increasing requirement for lead-free solders, it is desired to know how different solder alloys affect on reliability of microelectronic assembly. Some fatigue life models for Sn-Ag-Cu (SAC) solder have been developed by researchers. The Ni-dopant lead free solder is increasingly used in electronic packages due to its good drop performance. Currently, it lacks the fatigue life model for Ni doped SAC solder. In this paper, thermal cycling test and finite element simulation were conducted for 5 FBGA (Fine pitch BGA) assemblies with Sn-Ag-Cu-Ni (SACN) lead free solder. The thermal fatigue life prediction model was developed for FBGA assemblies with SACN solder by combining experimental and simulation results. The good correlation between predicted and experimental lives was achieved. In addition, the effect of geometry and loading condition on solder joint predicted life was investigated based on the finite element simulation result and the developed life model.

Keywords

alloys; ball grid arrays; fatigue; fine-pitch technology; finite element analysis; microassembling; solders; FBGA assembly; SACN lead free solder; SnAgCuNi; drop performance; electronic package; fatigue model development; fine pitch BGA assembly; finite element simulation; geometry; lead-free solder; loading condition; microelectronic assembly; reliability; solder alloy; thermal cycling; thermal fatigue life prediction model; Assembly; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Fatigue; Finite element methods; Lead; Microelectronics; Predictive models; Solid modeling; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International

Conference_Location

Penang

ISSN

1089-8190

Print_ISBN

978-1-4244-3392-6

Electronic_ISBN

1089-8190

Type

conf

DOI

10.1109/IEMT.2008.5507875

Filename

5507875