• DocumentCode
    2994327
  • Title

    Applications of silicon microactuators based on bimorph structures

  • Author

    Benecke, W. ; Riethmü, W.

  • Author_Institution
    Fraunhofer-Inst. fur Mikrostrukturtech., Berlin, West Germany
  • fYear
    1989
  • fDate
    20-22 Feb 1989
  • Firstpage
    116
  • Lastpage
    120
  • Abstract
    Microactuators for electromechanical signal conversion are described. Basic elements of the transducer are a bimorph structure and an integrated heat source. Due to the differences of the coefficients of thermal expansion, a temperature-controlled deformation of the the bimorph structure occurs. Bulk and surface micromachining techniques can be used to achieve an object displacement perpendicular to or within the substrate plane. The main advantages of this class of actuators are simple fabrication processes and operation at standard IC (integrated circuit) voltage levels, allowing further system integration. The conversion characteristics are described, and the application of these transducers for microvalves, optical components, manipulators, and motors is discussed
  • Keywords
    electric actuators; elemental semiconductors; piezoelectric transducers; semiconductor devices; silicon; valves; Si; bimorph structures; conversion characteristics; electromechanical signal conversion; fabrication processes; integrated heat source; manipulators; microactuators; microvalves; motors; object displacement; optical components; piezoelectric devices; semiconductor devices; standard IC voltage level operation; surface micromachining; temperature-controlled deformation; transducer; Actuators; Microactuators; Micromachining; Microvalves; Optical device fabrication; Optical devices; Silicon; Thermal expansion; Transducers; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1989, Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE
  • Conference_Location
    Salt Lake City, UT
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1989.77974
  • Filename
    77974