Title :
High-speed test hardware full path measurement using low loss PCB substrate
Author :
Ng Cheong Koon ; Cheah Shu Young ; Chow, Susan See-Chin ; Ong Ling Li
Author_Institution :
Intel Corp., Bayan Lepas, Malaysia
Abstract :
High-speed Input/Output (I/O) measurements are crucial to ensure good signal integrity performances in High-speed interfaces. Modeling effects enable minimization of the throughput time from design, development and ultimately products to market. However, modeling needs validations to cross check the accuracy. Full path measurement is recommended to validate the performance of components within the channel by cascading them together. This paper introduces the advantages of replacing ceramic surrogate package with a low loss substrate, namely Roger 4350B. Basic concept and measurement setup in Functional/Structural Test and System Test will be explained.
Keywords :
printed circuit design; printed circuit testing; Roger 4350B; ceramic surrogate package; high-speed input/output measurement; high-speed test hardware full path measurement; low loss PCB substrate; Ceramics; Electronics packaging; Fixtures; Hardware; Loss measurement; Performance evaluation; Probes; Sockets; System testing; Topology;
Conference_Titel :
Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Conference_Location :
Penang
Print_ISBN :
978-1-4244-3392-6
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2008.5507877
