Precise control of 8 terminal capacitor placement on fully populated PGA singulated substrate

Attaching small component size of 8 Terminal Capacitors onto fully populated pin of PGA substrate has become very challenging during assembly process. A methodology was developed to precisely control the 50 um high accuracy of capacitor placement prior to solder paste reflow. Four corners holding top clamp on chip shooter machine was used to ensure the sitting of all singulated substrates onto respective cavity of carrier are firmed hold. Single piece nozzle design made of ceramic for capacitor pickup has proven to effectively holding the capacitor during pickup, transporting and placement without damaging the nozzle tip which can cause misaligned capacitor during placement. Besides, implementation of interval blow-off feature before each capacitor pickup has managed to eliminate dust clogging in the nozzle. Additional periodical placement accuracy checking for calibration on precise singulated glass plate per carrier cavity matrix was carried out to control equipment capability in achieving 50 um placement accuracy at all time.