Title :
Three-dimensional routing for multilayer ceramic printed circuit boards
Author :
Hanafusa, A. ; Yamashita, Y. ; Yasuda, M.
Author_Institution :
Fujitsu Ltd., Tokyo, Japan
Abstract :
An efficient three-dimensional (3-D) routing technique is presented for multilayer ceramic printed circuit (PC) boards. The router can take account of via length as well as pattern length. In the first of the two steps involved, it searches in the direction of via depth from start and end points only. This is called two-and-a-half-dimension (2.5-D) routing. Step two combines 2-D and 3-D routing for wiring not covered in step one. This enables tens of thousands of wires to be routed at 99% effectiveness in less than four hours of CPU time, with all delay conditions satisfied.<>
Keywords :
circuit layout CAD; printed circuit design; multilayer ceramic printed circuit boards; pattern length; three dimensional routing; via length; Ceramics; Delay effects; Large scale integration; Nonhomogeneous media; Printed circuits; Routing; Supercomputers; System performance; Wires; Wiring;
Conference_Titel :
Computer-Aided Design, 1990. ICCAD-90. Digest of Technical Papers., 1990 IEEE International Conference on
Conference_Location :
Santa Clara, CA, USA
Print_ISBN :
0-8186-2055-2
DOI :
10.1109/ICCAD.1990.129932
