DocumentCode
2995390
Title
Stress grading in integrated power modules
Author
Duchesne, C. ; Lebey, T. ; Guyennet, M. Mermet ; Dutarde, E. ; Dagdag, S.
Author_Institution
Power Electron. Associated Res. Lab., Semeac
fYear
2007
fDate
14-17 Oct. 2007
Firstpage
533
Lastpage
536
Abstract
Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
Keywords
electronics packaging; permittivity; power electronics; reliability; integrated power modules; permittivity; power electronics packaging; reliability; stress grading; Conductivity; Dielectrics and electrical insulation; Electronics packaging; Metallization; Multichip modules; Permittivity; Power electronics; Semiconductor materials; Stress; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
Conference_Location
Vancouver, BC
Print_ISBN
978-1-4244-1482-6
Electronic_ISBN
978-1-4244-1482-6
Type
conf
DOI
10.1109/CEIDP.2007.4451480
Filename
4451480
Link To Document