Title :
A Ka-band fully integrated transceiver multi-chip-module based on aluminum nitride multi-layer LCC package with the waveguide interface
Author :
Akaishi, M. ; Kaneko, T. ; Yakuwa, N. ; Wada, K. ; Myohga, O.
Author_Institution :
Microwave & Satellite Commun. Div., NEC Corp., Yokohama, Japan
Abstract :
A super miniaturized transceiver module whose size is 35 mm/spl times/35 mm/spl times/6 mm has been successfully developed for LMDS (Local Multipoint Distribution System). The module, which can be directly connected to an antenna consists of all active circuits and a frequency duplexer using the newly developed drop-in circulator. An AlN multilayer LCC package was employed in consideration of transmission loss and thermal management. The saturated output power of 23 dBm, the phase noise of 91 dBc/Hz@100 kHz off, and the receiver noise figure of 7.0 dB are obtained in 30 GHz band.
Keywords :
aluminium compounds; millimetre wave circulators; millimetre wave receivers; mobile radio; multichip modules; phase noise; transceivers; 30 GHz; 7.0 dB; AlN; Ka-band; LMDS; active circuits; drop-in circulator; frequency duplexer; local multipoint distribution system; multi-chip-module; multi-layer LCC package; phase noise; receiver noise figure; saturated output power; thermal management; transceiver; transmission loss; waveguide interface; Active circuits; Frequency; Nonhomogeneous media; Packaging; Phase noise; Power generation; Power system management; Propagation losses; Thermal management; Transceivers;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779804