• DocumentCode
    2995933
  • Title

    Extraction based verification method for off the shelf integrated circuits

  • Author

    Saab, Daniel G. ; Nagubadi, Vivek ; Kocan, Fatih ; Abraham, Jacob

  • Author_Institution
    Dept. of EECS, Case Western Reserve Univ., Cleveland, OH, USA
  • fYear
    2009
  • fDate
    15-16 July 2009
  • Firstpage
    396
  • Lastpage
    400
  • Abstract
    Off-the-shelf integrated circuits (ICs) are used in the design of many products. The IC is supposed to implement a set of available specifications describing the function of the IC. Users of off-the-shelf ICs need a simple and effective method to validate the specifications to insure that the IC implements exclusively the set of available specifications. In this paper, we propose an approach to validate these specifications by a set of IC re-engineering experiments. The proposed approach is based on the construction of a high-level description of the packaged IC and on using the extracted description to validate the specifications. The approach uses the scan operations (available for manufacturing test of the IC) and the IC specification to disassemble the states/flip-flops and output functions of the packaged IC. Using the disassembled functions, a register transfer level (RTL) model suitable for computer-aided design manipulation is constructed. The disassembling is based on an ATPG scan experiment. Information on the scan chains is employed to construct the connectivity of the logic function. The connectivity is then used to discover the implemented logic. Using the proposed approach, we re-constructed over 90% of the system functions for an example IC.
  • Keywords
    circuit CAD; integrated circuit design; integrated circuit packaging; ATPG; automatic test pattern generation tool; computer-aided design manipulation; extraction based verification method; flip-flops; high-level description; logic function; off the shelf integrated circuit; register transfer level model; Automatic test pattern generation; Computer aided manufacturing; Design automation; Flip-flops; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit testing; Product design; Registers; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-4952-1
  • Electronic_ISBN
    978-1-4244-4952-1
  • Type

    conf

  • DOI
    10.1109/ASQED.2009.5206228
  • Filename
    5206228