• DocumentCode
    2995969
  • Title

    Molecular dynamics simulation of characteristics of polymer matrices in nanocomposites

  • Author

    Sawa, F. ; Imai, T. ; Ozaki, T. ; Shimizu, T. ; Tanaka, T.

  • Author_Institution
    Toshiba Corp., Yokohama
  • fYear
    2007
  • fDate
    14-17 Oct. 2007
  • Firstpage
    263
  • Lastpage
    266
  • Abstract
    Interfaces are considered to play a predominant role in polymer nanocomposites. Many studies have been made in terms of macroscopic characteristic parameters such as permittivity, breakdown voltage and partial discharge resistance. However, few studies have been made to clarify the mesoscopic structures of interfaces between inorganic nano-fillers and surrounding polymer matrices. We conducted a coarse-grained molecular dynamics simulation to investigate the segment motion of polymers near nano-fillers. Parameters of the Lennard Jones potential between surfaces of nano-fillers and polymer segments were changed to simulate "wetting" and "de-wetting" conditions. Two regions of interfaces were clearly recognized as the outcome of the simulation, namely, one where polymer chains are totally bonded to the inorganic substrate, and one where their segmental motion is partially restricted.
  • Keywords
    Lennard-Jones potential; electric breakdown; filled polymers; molecular dynamics method; nanocomposites; partial discharges; Lennard Jones potential; breakdown voltage; coarse-grained molecular dynamics simulation; inorganic nanofillers; mesoscopic structures; nanocomposites; partial discharge resistance; permittivity; polymer; segment motion; wetting; Bonding; Dielectrics and electrical insulation; Mechanical factors; Nanocomposites; Plastics industry; Polymers; Potential energy; Research and development; Springs; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-1482-6
  • Electronic_ISBN
    978-1-4244-1482-6
  • Type

    conf

  • DOI
    10.1109/CEIDP.2007.4451514
  • Filename
    4451514