DocumentCode :
2995969
Title :
Molecular dynamics simulation of characteristics of polymer matrices in nanocomposites
Author :
Sawa, F. ; Imai, T. ; Ozaki, T. ; Shimizu, T. ; Tanaka, T.
Author_Institution :
Toshiba Corp., Yokohama
fYear :
2007
fDate :
14-17 Oct. 2007
Firstpage :
263
Lastpage :
266
Abstract :
Interfaces are considered to play a predominant role in polymer nanocomposites. Many studies have been made in terms of macroscopic characteristic parameters such as permittivity, breakdown voltage and partial discharge resistance. However, few studies have been made to clarify the mesoscopic structures of interfaces between inorganic nano-fillers and surrounding polymer matrices. We conducted a coarse-grained molecular dynamics simulation to investigate the segment motion of polymers near nano-fillers. Parameters of the Lennard Jones potential between surfaces of nano-fillers and polymer segments were changed to simulate "wetting" and "de-wetting" conditions. Two regions of interfaces were clearly recognized as the outcome of the simulation, namely, one where polymer chains are totally bonded to the inorganic substrate, and one where their segmental motion is partially restricted.
Keywords :
Lennard-Jones potential; electric breakdown; filled polymers; molecular dynamics method; nanocomposites; partial discharges; Lennard Jones potential; breakdown voltage; coarse-grained molecular dynamics simulation; inorganic nanofillers; mesoscopic structures; nanocomposites; partial discharge resistance; permittivity; polymer; segment motion; wetting; Bonding; Dielectrics and electrical insulation; Mechanical factors; Nanocomposites; Plastics industry; Polymers; Potential energy; Research and development; Springs; Surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
Conference_Location :
Vancouver, BC
Print_ISBN :
978-1-4244-1482-6
Electronic_ISBN :
978-1-4244-1482-6
Type :
conf
DOI :
10.1109/CEIDP.2007.4451514
Filename :
4451514
Link To Document :
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