Title :
A wideband CPW-to-microstrip transition for millimeter-wave packaging
Author :
Ellis, T.J. ; Raskin, J.P. ; Katehi, L.P.B. ; Rebeiz, G.M.
Author_Institution :
Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA
Abstract :
A broadband single layer vertical transition from CPW to microstrip has been developed for multilayer millimeter-wave circuits. The transition has exceptionally wide bandwidth and presents low insertion and return losses. A transition has been fabricated on a 100 /spl mu/m silicon wafer that shows approximately 0.3 dB of insertion loss and better than 10 dB return loss over 75-110 GHz. This transition can be used for the vertical integration of multi-layer millimeter wave circuits and packaging.
Keywords :
MIMIC; coplanar waveguide components; integrated circuit packaging; losses; microstrip circuits; microstrip transitions; millimetre wave integrated circuits; waveguide transitions; 0.3 dB; 10 dB; 100 micron; 75 to 110 GHz; EHF; Si; broadband single layer vertical transition; low insertion loss; low return loss; millimeter-wave packaging; multilayer MM-wave circuits; wideband CPW-to-microstrip transition; Coplanar waveguides; Electromagnetic coupling; Microstrip; Microwave circuits; Millimeter wave technology; Packaging; Power dividers; Slotline; Space technology; Wideband;
Conference_Titel :
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-5135-5
DOI :
10.1109/MWSYM.1999.779840
