• DocumentCode
    2996168
  • Title

    An equivalent circuit for the double bonding wire interconnection

  • Author

    Alimenti, F. ; Mezzanotte, P. ; Roselli, L. ; Sorrentino, R.

  • Author_Institution
    Dipt. di Ingegneria Elettronica e dell´Inf., Perugia Univ., Italy
  • Volume
    2
  • fYear
    1999
  • fDate
    13-19 June 1999
  • Firstpage
    633
  • Abstract
    This work proposes a quasi-static model for the double bonding wire interconnection. The wires have been assumed to be parallel, while their curvature has been described with an arc of circle. The model is based on the representation of the structure by means of four sections of a uniform, homogeneous transmission line. The characteristic impedance of this line can be evaluated analytically versus the wire spacing. A double bonding wire structure has been analyzed systematically. In order to determine the accuracy of the model, the same structure has been simulated with the FDTD technique. The quasi-static model has been found to be in good agreement with the full-wave model.
  • Keywords
    electric impedance; equivalent circuits; hybrid integrated circuits; integrated circuit interconnections; lead bonding; microwave integrated circuits; millimetre wave integrated circuits; transmission line theory; MM-wave ICs; characteristic impedance; double bonding wire interconnection; equivalent circuit; microwave ICs; quasi-static model; uniform homogeneous transmission line; wire curvature; wire spacing; Bonding; Circuit simulation; Equivalent circuits; Finite difference methods; Impedance; Inductance; Integrated circuit interconnections; Time domain analysis; Transmission lines; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1999 IEEE MTT-S International
  • Conference_Location
    Anaheim, CA, USA
  • Print_ISBN
    0-7803-5135-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.1999.779841
  • Filename
    779841