DocumentCode
2996168
Title
An equivalent circuit for the double bonding wire interconnection
Author
Alimenti, F. ; Mezzanotte, P. ; Roselli, L. ; Sorrentino, R.
Author_Institution
Dipt. di Ingegneria Elettronica e dell´Inf., Perugia Univ., Italy
Volume
2
fYear
1999
fDate
13-19 June 1999
Firstpage
633
Abstract
This work proposes a quasi-static model for the double bonding wire interconnection. The wires have been assumed to be parallel, while their curvature has been described with an arc of circle. The model is based on the representation of the structure by means of four sections of a uniform, homogeneous transmission line. The characteristic impedance of this line can be evaluated analytically versus the wire spacing. A double bonding wire structure has been analyzed systematically. In order to determine the accuracy of the model, the same structure has been simulated with the FDTD technique. The quasi-static model has been found to be in good agreement with the full-wave model.
Keywords
electric impedance; equivalent circuits; hybrid integrated circuits; integrated circuit interconnections; lead bonding; microwave integrated circuits; millimetre wave integrated circuits; transmission line theory; MM-wave ICs; characteristic impedance; double bonding wire interconnection; equivalent circuit; microwave ICs; quasi-static model; uniform homogeneous transmission line; wire curvature; wire spacing; Bonding; Circuit simulation; Equivalent circuits; Finite difference methods; Impedance; Inductance; Integrated circuit interconnections; Time domain analysis; Transmission lines; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1999 IEEE MTT-S International
Conference_Location
Anaheim, CA, USA
Print_ISBN
0-7803-5135-5
Type
conf
DOI
10.1109/MWSYM.1999.779841
Filename
779841
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