• DocumentCode
    2996339
  • Title

    Examination of conversion degree of composite insulating materials

  • Author

    Mentlík, V. ; Polanský, R.

  • Author_Institution
    West Bohemia Univ., Pilsen
  • fYear
    2007
  • fDate
    14-17 Oct. 2007
  • Firstpage
    735
  • Lastpage
    738
  • Abstract
    Composite insulating materials have their important place in high-voltage insulating technology. The quality and high reliability of electrical devices is much affected by the curing level of these materials. Curing level is quantified by so-called degree of conversion and there are several possibilities how to determine this degree in practice. Attention is given mainly to kinetic analysis based techniques. Kinetic analysis use specific mathematic models, which work on the basis of Arrhenius law (kinetic analysis of thermal stability, isothermal kinetic analysis, Borchardt and Daniels kinetic analysis). The main objective is to compare results of selected methods; these data were subsequently verified via residual enthalpy measurement. Two composites (insulating tapes with different curing agent composed of glass fabric, mica and epoxy binder) were examined. The measurement carried out on simultaneous thermal analysis (STA), which allows the simultaneous measuring by differential scanning calorimetry (DSC) and thermogravimetry (TGA). Obtained results highly refer to advantages and disadvantages of selected methods.
  • Keywords
    composite insulating materials; curing; differential scanning calorimetry; enthalpy; epoxy insulation; fabrics; glass; mica; thermal stability; Arrhenius law; Borchardt kinetic analysis; Daniels kinetic analysis; SiO2Jk; composite insulating materials; conversion degree; curing agent; curing level; differential scanning calorimetry; electrical device reliability; epoxy binder; glass fabric; high-voltage insulating technology; insulating tapes; isothermal kinetic analysis; mathematic models; mica; residual enthalpy; simultaneous thermal analysis; thermal stability; thermogravimetry; Composite materials; Curing; Insulation; Isothermal processes; Kinetic theory; Materials reliability; Mathematical model; Mathematics; Stability analysis; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
  • Conference_Location
    Vancouver, BC
  • Print_ISBN
    978-1-4244-1482-6
  • Electronic_ISBN
    978-1-4244-1482-6
  • Type

    conf

  • DOI
    10.1109/CEIDP.2007.4451536
  • Filename
    4451536