DocumentCode
2996339
Title
Examination of conversion degree of composite insulating materials
Author
Mentlík, V. ; Polanský, R.
Author_Institution
West Bohemia Univ., Pilsen
fYear
2007
fDate
14-17 Oct. 2007
Firstpage
735
Lastpage
738
Abstract
Composite insulating materials have their important place in high-voltage insulating technology. The quality and high reliability of electrical devices is much affected by the curing level of these materials. Curing level is quantified by so-called degree of conversion and there are several possibilities how to determine this degree in practice. Attention is given mainly to kinetic analysis based techniques. Kinetic analysis use specific mathematic models, which work on the basis of Arrhenius law (kinetic analysis of thermal stability, isothermal kinetic analysis, Borchardt and Daniels kinetic analysis). The main objective is to compare results of selected methods; these data were subsequently verified via residual enthalpy measurement. Two composites (insulating tapes with different curing agent composed of glass fabric, mica and epoxy binder) were examined. The measurement carried out on simultaneous thermal analysis (STA), which allows the simultaneous measuring by differential scanning calorimetry (DSC) and thermogravimetry (TGA). Obtained results highly refer to advantages and disadvantages of selected methods.
Keywords
composite insulating materials; curing; differential scanning calorimetry; enthalpy; epoxy insulation; fabrics; glass; mica; thermal stability; Arrhenius law; Borchardt kinetic analysis; Daniels kinetic analysis; SiO2Jk; composite insulating materials; conversion degree; curing agent; curing level; differential scanning calorimetry; electrical device reliability; epoxy binder; glass fabric; high-voltage insulating technology; insulating tapes; isothermal kinetic analysis; mathematic models; mica; residual enthalpy; simultaneous thermal analysis; thermal stability; thermogravimetry; Composite materials; Curing; Insulation; Isothermal processes; Kinetic theory; Materials reliability; Mathematical model; Mathematics; Stability analysis; Thermal stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2007. CEIDP 2007. Annual Report - Conference on
Conference_Location
Vancouver, BC
Print_ISBN
978-1-4244-1482-6
Electronic_ISBN
978-1-4244-1482-6
Type
conf
DOI
10.1109/CEIDP.2007.4451536
Filename
4451536
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