• DocumentCode
    2996476
  • Title

    Impact Research of Process Parameters on Sink Index of Rapid Heat Cycle Molding Products

  • Author

    Ling, Sun ; Liu Donglei

  • Author_Institution
    Inst. of Mech. & Electr. Eng., Nanchang Univ., Nanchang, China
  • fYear
    2010
  • fDate
    25-27 June 2010
  • Firstpage
    2793
  • Lastpage
    2796
  • Abstract
    Taking the independently designed in-vehicle Bluetooth high glossy product as an example, in combination with the Taguchi experiment and the simulation technology, the experimental research of the impact of Rapid Heat Cycle Molding(RHCM) process on the sink mark of the product is conducted through the introduction of interference factors. The results show that the technical characteristics of high mold temperature cavity filling, pressure holding and quick cooling can effectively reduce the sink index of the RHCM molded product; the impact of the pressure factor and the temperature factor on the sink index of the RHCM molded product is more significant, while the time factor performs very slight impact, and the significance sequence of the impact of all the parameters is listed into "Packing Pressure - Injecting Pressure - Melt Temperature - Mold Temperature - Packing Time - Cooling Time"; and compared with the common molding, the impact of pressure holding time on the sink index of the RHCM molded product is significantly increased.
  • Keywords
    Bluetooth; injection moulding; RHCM process; in-vehicle Bluetooth high glossy product; process parameters; rapid heat cycle molding products; sink index; Analytical models; Cavity resonators; Cooling; Filling; Indexes; Plastics; Temperature; Interference Factor; Rapid Heat Cycle Molding; Sink Index; Stimulation Analysis; Taguchi Experiment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Control Engineering (ICECE), 2010 International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-6880-5
  • Type

    conf

  • DOI
    10.1109/iCECE.2010.682
  • Filename
    5630694