DocumentCode
2996876
Title
Prototyping and testing of analog integrated circuits
Author
Pann, Peter
Author_Institution
Austriamicrosystems, Unterpremstaetten, Austria
fYear
2009
fDate
15-16 July 2009
Firstpage
173
Lastpage
177
Abstract
The author describes various procedures to minimize risks involved in prototyping of analogue and mixed signal integrated circuits at external fabs and compares different approaches of minimizing NRE costs. Additionally the author describes multi product wafer (MPW) or multi layer mask (MLM) service and procedures of parallel processing of different design versions on one mask set. Furthermore he gives some guidelines for efficient production ramp-up and yield optimization and opens a discussion on the optimization on back-end assembly and test activities. Finally several online tools provided by foundries from the engineering phase through production will be discussed.
Keywords
analogue integrated circuits; mixed analogue-digital integrated circuits; analog integrated circuit; mixed signal integrated circuit; multilayer mask service; multiproduct wafer service; Analog integrated circuits; Circuit testing; Costs; Guidelines; Integrated circuit testing; Mixed analog digital integrated circuits; Parallel processing; Process design; Production; Prototypes;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2009. ASQED 2009. 1st Asia Symposium on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-4952-1
Electronic_ISBN
978-1-4244-4952-1
Type
conf
DOI
10.1109/ASQED.2009.5206277
Filename
5206277
Link To Document