DocumentCode
2997362
Title
Using Run-Time Reconfiguration to Implement Fault-Tolerant Coarse Grained Reconfigurable Architectures
Author
Schweizer, Thomas ; Küster, Anja ; Eisenhardt, Sven ; Kuhn, Tommy ; Rosenstiel, Wolfgang
Author_Institution
Comput. Eng., Eberhard Karls Univ. Tubingen, Tübingen, Germany
fYear
2012
fDate
21-25 May 2012
Firstpage
320
Lastpage
327
Abstract
Triple modular redundancy (TMR) is a common method to implement fault-tolerant circuits. Traditionally, TMR is realized by triplication of components. In order to reduce the area overhead of TMR another approach was proposed on coarse grained reconfigurable architectures (CGRAs). In that approach spare functional units (FUs) are used for redundant computation of results. However, it was not shown that this approach is workable for any application. In this work we close that gap. We mapped several multipoint fast Fourier transform on a CGRA of different array sizes and analyzed the ratio of spare FUs to used FUs. If the number of spare FUs is not sufficient to find a fault-tolerant application mapping, we propose to use run-time reconfiguration to extend the number of spare FUs in the time domain. We compared this strategy with the traditional approach in terms of area and throughput. The comparing results show that run-time reconfiguration can be a suitable method for decreasing the area overhead of TMR, however at the expense of lower throughput.
Keywords
fast Fourier transforms; fault tolerant computing; reconfigurable architectures; CGRA; FU; TMR; fast Fourier transform; fault-tolerant application mapping; fault-tolerant circuits; fault-tolerant coarse grained reconfigurable architectures; run-time reconfiguration; spare functional units; triple modular redundancy; Clocks; Context; Delay; Fault tolerant systems; Redundancy; Tunneling magnetoresistance; TMR; coarse-grained; reconfiguration; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Parallel and Distributed Processing Symposium Workshops & PhD Forum (IPDPSW), 2012 IEEE 26th International
Conference_Location
Shanghai
Print_ISBN
978-1-4673-0974-5
Type
conf
DOI
10.1109/IPDPSW.2012.39
Filename
6270658
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