DocumentCode :
2997414
Title :
Interoperating AutoSched AP using the High Level Architecture
Author :
Gan, Boon Ping ; Lendermann, Peter ; Yoke, Malcolm ; Low, Hean ; Turner, Stephen J. ; Wang, Xiaoguang ; Taylor, Simon J E
Author_Institution :
D-SIMLAB Programme, Singapore Inst. of Manuf. Technol., Singapore
fYear :
2005
fDate :
4-7 Dec. 2005
Abstract :
The high Level Architecture (HLA) is an IEEE standard for interoperating simulation federates. In this paper, we describe a set of requirements that simulation packages need to satisfy in order to be made interoperable using the HLA standard. AutoSched AP, a commercial off-the-shelf simulation package (CSP) which is widely used in the semiconductor industry, was used as a case study for this interoperation exercise. We demonstrated that a straightforward customization of the CSP through a middleware that provides standard functions for interoperation may not provide a satisfactory solution. A specially optimized time synchronization mechanism needs to be installed to ensure good execution efficiency. Experimental results using a Borderless Fab model that comprises of two factory models show that an optimized time synchronization mechanism results in an execution time that is ten times better than a straightforward application of the HLA runtime infrastructure´s time synchronization mechanism.
Keywords :
digital simulation; open systems; software architecture; software packages; HLA runtime infrastructure; HLA standard; High Level Architecture; IEEE standard; commercial off-the-shelf simulation package; interoperating AutoSched AP; interoperating simulation federates; middleware; simulation packages; time synchronization mechanism; Business; Chip scale packaging; Communication standards; Computational modeling; Electronics industry; Gallium nitride; Production facilities; Semiconductor device packaging; Standards development; Standards organizations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference, 2005 Proceedings of the Winter
Print_ISBN :
0-7803-9519-0
Type :
conf
DOI :
10.1109/WSC.2005.1574274
Filename :
1574274
Link To Document :
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