• DocumentCode
    2997853
  • Title

    Non-destructive method to estimate the moisture content in bread using multi-channel electrical impedance spectroscopy

  • Author

    Bhatt, Chintan M. ; Nagaraju, J.

  • Author_Institution
    Dept. of Instrum., Indian Inst. of Sci., Bangalore
  • fYear
    2009
  • fDate
    17-19 Feb. 2009
  • Firstpage
    56
  • Lastpage
    60
  • Abstract
    Bread undergoes several physicochemical changes during storage that results in a rapid loss of freshness. These changes depend on moisture content present in bread product. An instrument based on electrical impedance spectroscopy technique is developed to estimate moisture content of bread at different zones using designed multi-channel ring electrodes. A dedicated AT89S52 microcontroller and associated peripherals are employed for hardware. A constant current is applied across bread loaf through central pair of electrodes and developed potential across different zones of bread loaf are measured using remaining four ring electrode pairs. These measured values of voltage and current are used to measure the impedance at each zone. Electrical impedance behavior of the bread loaf at crust and crumb is investigated during storage. A linear relationship is observed between the measured impedance and moisture content present in crust and crumb of bread loaf during storage of 120 hours.
  • Keywords
    food products; food technology; nondestructive testing; AT89S52 microcontroller; bread loaf; electrical impedance behavior; electrical impedance spectroscopy technique; moisture content estimation; multichannel electrical impedance spectroscopy; multichannel ring electrodes; nondestructive method; physicochemical changes; Biomedical monitoring; Current measurement; Electrochemical impedance spectroscopy; Electrodes; Frequency; Impedance measurement; Instruments; Microcontrollers; Moisture measurement; Virtual manufacturing; Bread; impedance spectroscopy; moisture content; multi-channel ring electrodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors Applications Symposium, 2009. SAS 2009. IEEE
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    978-1-4244-2786-4
  • Electronic_ISBN
    978-1-4244-2787-1
  • Type

    conf

  • DOI
    10.1109/SAS.2009.4801777
  • Filename
    4801777